Koch-Chemie Micro Cut Pad
- Compression hardness: 10
- Abrasiveness: 5
- Open cellular structure
- Optimally suited for working with Micro Cut M3.02, Micro Cut & Finish P3.01
$17.95 – $56.95
High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23 mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.
Compression hardness: 10. Abrasiveness: 5.
Additional information
Weight | N/A |
---|---|
Size | 45 x 23 mm (set of 5), 76 x 23 mm, 126 x 23 mm, 150 x 23 mm |
Suitable for | Professionals, Enthusiasts |
Availability |
Now available in-store at 18 Currys Lane Auckland 0627 Powered With Oliver Pos |
---|
Notice
This product information can advise you only without obligation. Liability on our part can not be derived. Please, check whether the product is suitable for your application. We will be pleased to assist you.
Reviews
You may also like…
-
Sale!
Koch-Chemie BMP S0.01 — Finishing Wax
Original price was: $38.95.$33.95Current price is: $33.95. -
Koch-Chemie Micro Cut & Finish P3.01 — Hologram Remover with Carnauba
$44.95 – $139.95 -
Sale!
Koch-Chemie Ultimate Polishing Kit
Original price was: $213.95.$179.95Current price is: $179.95. -
Sale!
Koch-Chemie Micro Cut M3.02 — Silicone-Free Micro Polishing Compound
$35.95 – $103.95
Reviews
There are no reviews yet.