Koch-Chemie Polish & Sealing Pad
- Compression hardness: 4
- Abrasiveness: 2
- Open cellular structure
- Designed for working with sealing products, such as Lack-Polish compounds or 1K-Nano
$29.95 – $56.95
Extra-fine finish sponge for economically and evenly applying sealing products such as the 1K Nano or Lack-Polish grün P1.01. The short height of 23 mm creates low torsion forces, excellent handling and the highest level of stability. The optimised reticulation (open cellular structure) and cell count contribute to excellent hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.
Compression hardness: 4. Abrasiveness: 2.
Additional information
| Weight | N/A |
|---|---|
| Size | 45 x 23 mm (set of 5), 126 x 23 mm, 150 x 23 mm |
| Suitable for | Professionals, Enthusiasts |
Notice
This product information can advise you only without obligation. Liability on our part can not be derived. Please, check whether the product is suitable for your application. We will be pleased to assist you.
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